GrindersMachining centers / Ultrasonic

Micro grinding machine MC50

Compact 5-axis machining center with ultrasonic technology
Data sheet:

The MC50 micro grinding machine is a high-precision 5-axis machining center. All axes are controlled directly via linear and torque motors. The machine is ideal for grinding and micro milling. Direct drives, optical measuring systems and versatile spindle options enable efficient and precise machining. The optional ultrasonic technology is particularly suitable for grinding brittle-hard materials such as glass and ceramics. The machining area is made entirely of stainless steel.

MC50 Schleifmaschinen Bearbeitungszentre Ultrasonic

MC50 – Compact performance with maximum precision

The MC50 micro grinding machine is a powerful and compact 5-axis machining center that has been specially developed for high-precision applications. With this machine, we offer an innovative solution in the field of 5-axis precision machining with a minimal footprint. With direct drives and a robust design, the MC50 micro grinding machine achieves maximum precision in demanding manufacturing processes. Motor spindles with HSK E50 or E32 with up to 60,000 rpm enable flexible material processing, while the optional ultrasonic technology is particularly optimized for hard-brittle materials such as glass and ceramics. The intelligent control and versatile automation options make this machine the ideal choice for the precision optics, precision mechanics and ceramics industries.

Main features:

  • Compact design: 5-axis machining on a footprint of just 1.78 m²
  • Direct drives: linear motors and torque motors for maximum precision
  • Versatile spindles: HSK E50 & HSK E32 with up to 60,000 rpm
  • Ultrasonic machining: with inductive energy transfer for HSK E50
  • Automatic tool changer: space for up to 18 tools
  • High-precision measuring systems: Integrated glass scales for exact repeatability
  • Corrosion protection: Complete machining area in stainless steel design
  • Control system: B&R CNC or Siemens ONE

 

KomponenteEigenschaftWert
X-AchseVerfahrweg350 mm
Auflösung0.001 mm
Vorschub0 – 30‘000 mm/min
Y-AchseVerfahrweg240 mm
Auflösung0.001 mm
Vorschub0 – 30‘000 mm/min
Z-AchseVerfahrweg250 mm
Auflösung0.001 mm
Vorschub0 – 30‘000 mm/min
A-Achse (optional)Bereich-91° / +101°
Auflösung0.001°
Dauermoment117 Nm
Spitzenmoment223 Nm
Haltemoment420 Nm (geklemmt)
C-Achse (optional)Bereich360°
Drehzahl0-1700 U/min
Dauermoment35 Nm
Spitzenmoment66 Nm
Haltemoment270 Nm (geklemmt)
Spindel HSK E50Drehzahl18‘000 U/min
(Ultrasonic Tools)10‘000 U/min
Leistung S17.5 kW
Innenkühlung40 bar
Spindel HSK E32Drehzahl36‘000 U/min
Leistung S14.7 kW
Innenkühlung40 bar
Dimensionen
(ohne Panel/Absaugung)
L x T x H1343 x 1325 x 2480 mm
Elektr. Anschluss3 x 400V, 50Hz, L+N+PE / 64A
Druckluftanschluss6 bar
Aufstellfläche1600 x 2100 mm
Gewicht3300 kg
FarbeRAL 7035 / 3003

Subject to technical changes.

The MC50 micro sanding machine offers maximum precision and efficiency for demanding industrial manufacturing processes.

Do you have any questions about Micro grinding machine MC50?

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